Display module

ABSTRACT

A display module includes a display area and a non-display area disposed outside the display area on a plane. The display module includes a base layer, a circuit device layer, a display device layer, a thin film encapsulation layer, and a touch sensing layer. An inorganic layer of the touch sensing layer contacts an inorganic layer of the circuit device layer exposed by an organic layer of the circuit device layer. An inorganic layer of the thin film encapsulation layer is disposed between the inorganic layer of the touch sensing layer and the inorganic layer of the circuit device layer to block a moisture penetration path which causes delamination of the thin film encapsulation layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2016-0127047, filed on Sep. 30, 2016, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND FIELD

Exemplary embodiments relate to a display module. More particularly,exemplary embodiments relate to a display panel with a touch sensingunit integrated therein.

DISCUSSION OF THE BACKGROUND

Various display apparatuses used in multimedia devices such astelevisions, mobile phones, table computers, navigation devices, andgame consoles are being developed. Such a display apparatus may includea keyboard or a mouse as an input unit. Also, in recent years, displayapparatuses have begun including a touch panel as an input unit.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the inventive concept,and, therefore, it may contain information that does not form the priorart that is already known in this country to a person of ordinary skillin the art.

SUMMARY

Exemplary embodiments provide a display module in which the number ofdefects is reduced.

Additional aspects will be set forth in the detailed description whichfollows, and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concept.

An exemplary embodiment of the inventive concept provides a displaymodule including a base layer, a circuit device layer disposed on thebase layer, a display device layer disposed on the circuit device layer,a thin film encapsulation layer, and a touch sensing layer. The baselayer includes a display area and a non-display area disposed outsidethe display area. The circuit device layer includes an intermediateinorganic layer overlapping the display area and the non-display area,an intermediate organic layer disposed on the intermediate inorganiclayer to expose a portion of the intermediate inorganic layer within thenon-display area, and a circuit device. The display device layerincludes display devices disposed on the display area. The thin filmencapsulation layer includes a first encapsulation inorganic layerincluding a first region overlapping the display area and a secondregion overlapping the non-display area and having a thickness less thanthat of the first region. The touch sensing layer includes a pluralityof touch electrodes and a inorganic touch layer overlapping the displayarea and the non-display area and contacting the intermediate inorganiclayer exposed by the intermediate organic layer.

In an embodiment, an edge of the intermediate organic layer may bedisposed inside an edge of the intermediate inorganic layer on a topsurface of the base layer.

In an embodiment, the thickness of the second region may become smalleras a distance from the first region increases.

In an embodiment, the display module may further include a firstprotrusion part disposed outside an edge of the intermediate organiclayer and extending along the edge of the intermediate organic layer.The first protrusion part may surround the edge of the intermediateorganic layer.

In an embodiment, the circuit device may include signal lineselectrically connected to the display devices and signal pads connectedto ends of the signal lines. The signal pads are aligned in thenon-display area.

In an embodiment, a portion of the first protrusion part may be parallelto the aligned signal pads.

In an embodiment, the display module may further include a secondprotrusion part disposed between the portion of the first protrusionpart and the aligned signal pads and be parallel to the portion of thefirst protrusion part.

In an embodiment, the first protrusion part and the second protrusionpart may be disposed on the intermediate inorganic layer, and the secondprotrusion part may have a height greater than that of the firstprotrusion part. The first encapsulation inorganic layer may overlap thefirst protrusion part and the second protrusion part.

In an embodiment, the display module may further include an outerorganic layer connected to the second protrusion part, spaced apart fromthe intermediate organic layer, and disposed between the display areaand the aligned signal pads.

In an embodiment, an edge of the outer organic layer may be disposedinside an edge of the inorganic touch layer, and the edge of theinorganic touch layer may be disposed inside the edge of theintermediate inorganic layer.

In an embodiment, a portion of the first encapsulation inorganic layer,which does not overlap the outer organic layer, may be disposed betweenthe intermediate inorganic layer and the inorganic touch layer tocontact the intermediate inorganic layer and the inorganic touch layer.

In an embodiment, the non-display area may include a first non-bendingarea, a second non-bending area spaced apart from the first non-bendingarea in a first direction, and a bending area defined between the firstnon-bending area and the second non-bending area.

In an embodiment, the bending area may be bent so that a bending axis isdefined in a second direction perpendicular to the first direction.

In an embodiment, the intermediate inorganic layer may have a groovethrough which a portion of the non-display area of the base layer isexposed, and a dummy organic pattern may be disposed inside the groove.

In an embodiment, the display module may further include inorganicmaterial lines disposed outside an edge of the intermediate inorganiclayer to extend along the edge of the intermediate inorganic layer. Theinorganic touch layer may be spaced apart from the inorganic materiallines.

In an embodiment, the touch sensing layer may further include a touchorganic layer disposed on the inorganic touch layer to cover the touchelectrodes. The touch organic layer may overlap the inorganic materiallines.

In an embodiment, the thin film encapsulation layer may further include:a second encapsulation inorganic layer disposed between the displaydevice layer and the first encapsulation inorganic layer; and anencapsulation organic layer disposed between the first encapsulationinorganic layer and the second encapsulation inorganic layer.

An exemplary embodiment of the inventive concept also provides a displaymodule including: a base layer having a display area and a non-displayarea disposed outside the display area, and a circuit device includingan intermediate inorganic layer overlapping the display area and thenon-display area and an intermediate organic layer disposed on theintermediate inorganic layer to expose a portion of the intermediateinorganic layer within the non-display area. The display module furtherincludes organic light emitting diodes disposed on the intermediateorganic layer to overlap the display area, an encapsulation inorganiclayer disposed on the intermediate organic layer to cover the organiclight emitting diodes, and a touch sensing layer including a pluralityof touch electrodes and a inorganic touch layer overlapping the displayarea and the non-display area and contacting the intermediate inorganiclayer exposed by the intermediate organic layer, with the touch sensinglayer being disposed on the encapsulation inorganic layer.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE FIGURES

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concept, and, together with thedescription, serve to explain principles of the inventive concept.

FIG. 1 is a perspective view of a display module according to anexemplary embodiment.

FIG. 2 is a cross-sectional view of the display module according to anexemplary embodiment.

FIG. 3 is a plan view of a display panel according to an exemplaryembodiment.

FIG. 4 is an equivalent circuit diagram of a pixel according to anexemplary embodiment.

FIG. 5 is an enlarged cross-sectional view of the display panelaccording to an exemplary embodiment.

FIG. 6A is a cross-sectional view of a touch sensing unit according toan exemplary embodiment.

FIG. 6B is a plan view of the touch sensing unit according to anexemplary embodiment.

FIG. 7A is a cross-sectional view of a touch sensing unit according toan exemplary embodiment.

FIG. 7B is a plan view of the touch sensing unit according to anexemplary embodiment.

FIG. 8A, FIG. 8B, and FIG. 8C are enlarged cross-sectional views of thedisplay module according to an exemplary embodiment.

FIG. 9A and FIG. 9B are plan views illustrating a process ofmanufacturing the display module according to an exemplary embodiment.

FIG. 10A, FIG. 10B, and FIG. 10C are views illustrating a process offorming a thin film encapsulation layer of FIGS. 8A to 9B.

FIG. 11A and FIG. 11B are plan views comparing the display moduleaccording to an exemplary embodiment to a display module according toComparative Example.

FIG. 12A and FIG. 12B are perspective views of a display moduleaccording to an exemplary embodiment.

FIG. 13 is a plan view of the display module according to an exemplaryembodiment.

FIG. 14 is a cross-sectional view of the display module according to anexemplary embodiment.

FIG. 15 is a perspective view of a display device according to anexemplary embodiment.

FIG. 16 is a plan view of the display module according to an exemplaryembodiment.

FIG. 17 is a cross-sectional view of the display module according to anexemplary embodiment.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments.

In the accompanying figures, the size and relative sizes of layers,films, panels, regions, etc., may be exaggerated for clarity anddescriptive purposes. Also, like reference numerals denote likeelements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

Although the terms first, second, etc. may be used herein to describevarious elements, components, regions, layers, and/or sections, theseelements, components, regions, layers, and/or sections should not belimited by these terms. These terms are used to distinguish one element,component, region, layer, and/or section from another element,component, region, layer, and/or section. Thus, a first element,component, region, layer, and/or section discussed below could be termeda second element, component, region, layer, and/or section withoutdeparting from the teachings of the present disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for descriptive purposes, and,thereby, to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the drawings. Spatiallyrelative terms are intended to encompass different orientations of anapparatus in use, operation, and/or manufacture in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and, as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. As such, the regions illustrated in the drawings areschematic in nature and their shapes are not intended to illustrate theactual shape of a region of a device and are not intended to belimiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a perspective view of a display module DM according to anexemplary embodiment of the inventive concept. FIG. 2 is across-sectional view of a display module DM according to an exemplaryembodiment of the inventive concept.

As illustrated in FIG. 1, a display surface IS on which an image IM isdisplayed is parallel to a surface that is defined by a firstdirectional axis DR1 and a second directional axis DR2. A normaldirection of the display surface IS, i.e., a thickness direction of thedisplay module DM is indicated as a third directional axis DR3. A frontsurface (or top surface) and a rear surface (or bottom surface) of eachof members is distinguished by the third directional axis DR3. However,directions indicated as the first to third directional axes DR1, DR2,and DR3 may be a relative concept and thus changed into differentdirections. Hereinafter, the first to third directions may be directionsindicated by the first to third directional axes DR1, DR2, and DR3 anddesignated by the same reference numerals, respectively.

The display module DM according to the current embodiment may be a flatrigid display module. However, embodiments of the inventive concept isnot limited thereto. For example, the display module according to anexemplary embodiment of the inventive concept may be a flexible displaymodule DM. The display module DM according to an exemplary embodiment ofthe inventive concept may be applied for large-sized electronic devicessuch as televisions and monitors and small and middle-sized electronicdevices such as mobile phones, tablet PC, navigation units for vehicles,game consoles, and smart watches.

As illustrated in FIG. 1, the display module DM includes a display areaDM-DA on which the image IM is displayed and a non-display area DM-NDAthat is adjacent to the display area DM-DA. The non-display area DM-NDAmay be an area on which an image is not displayed. FIG. 1 illustrates aflower vase as an example of the image IM. For example, the display areaDM-DA may have a rectangular shape. The non-display area DM-NDA maysurround the display area DM-DA. However, exemplary embodiments of theinventive concept are not limited thereto. For example, the display areaDM-DA and the non-display area DM-NDA may be relatively designed inshape.

FIG. 2 is a cross-sectional view of the display module DM according toan exemplary embodiment of the inventive concept. FIG. 2 illustrates across-section defined by the first directional axis DR1 and the thirddirectional axis DR3.

As illustrated in FIG. 2, the display module DM includes a display panelDP and a touch sensing unit TS (or a touch sensing layer). Although notseparately shown, the display module DM according to an exemplaryembodiment of the inventive concept may further include a protectionmember disposed on a bottom surface of the display panel DP and anantireflection member and/or a window member disposed on a top surfaceof the touch sensing unit TS.

The display panel DP may be an emission-type display panel. That is,exemplary embodiments of the inventive concept are not limited to a kindof display panels. For example, the display panel DP may be an organiclight emitting display panel and a quantum-dot light emitting displaypanel. In the organic light emitting display panel, a light emittinglayer includes an organic light emitting material. In the quantum-dotlight emitting display panel, a light emitting layer includes a quantumdot and a quantum rod. Hereinafter, the organic light emitting displaypanel will be described as an example of the display panel DP.

The display panel DP includes a base layer SUB, a circuit device layerDP-CL disposed on the base layer SUB, a display device layer DP-OLED,and a thin film encapsulation layer TFE. Although not separately shown,the display panel DP may further include functional layers such as theantireflection layer, a reflective index adjusting layer, and the like.

The base layer SUB may include at least one plastic film. The base layerSUB may include a plastic substrate, a glass substrate, a metalsubstrate, or an organic/inorganic composite substrate as a flexiblesubstrate. The display area DM-DA and the non-display area DM-NDA, whichare described with reference to FIG. 1, may be defined in the samemanner on the base layer SUB.

The circuit device layer DP-CL includes at least one intermediateinsulation layer and a circuit device. The intermediate insulation layerincludes at least one intermediate inorganic layer and at least oneintermediate organic layer. The circuit device includes signal lines, adriving circuit of the pixel, and the like. This will be described laterin detail.

The display device layer DP-OLED may include organic light emittingdiodes. The display device layer DP-OLED may further include an organiclayer such as a pixel defining layer.

The thin film encapsulation layer TFE seals the display device layerDP-OLED. The thin film encapsulation layer TFE includes at least oneinorganic layer (hereinafter, referred to as an encapsulation inorganiclayer). The thin film encapsulation layer TFE may further include atleast one organic layer (hereinafter, referred to as an encapsulationorganic layer). The encapsulation inorganic layer protects the displaydevice layer DP-OLED against moisture/oxygen, and the encapsulationorganic layer protects the display device layer DP-OLED against foreignsubstances such as dust particles. The encapsulation inorganic layer mayinclude a silicon nitride layer, a silicon oxynitride layer, a siliconoxide layer, a titanium oxide layer, or an aluminum oxide layer. Theencapsulation organic layer may include an acrylic-based organic layer,but exemplary embodiments of the inventive concept are not limitedthereto.

The touch sensing unit TS acquires coordinate information of an externalinput. The touch sensing unit TS may be directly disposed on the organiclight emitting display panel DP. In this specification, the term“directly disposed” means that a component is formed through thecontinuous process except that the component adheres by using a separateadhesion layer.

The touch sensing unit TS may have a multilayer structure. The touchsensing unit TS may include a conductive layer having a single-layer ormultilayer structure. The touch io sensing unit TS may include aninsulation layer having a single-layer or multilayer structure.

For example, the touch sensing unit TS may sense an external input in acapacitive manner. The exemplary embodiment of the inventive concept isnot specifically limited to the operation manner of the touch sensingunit TS. In an exemplary embodiment of the inventive concept, the touchsensing unit TS may sense an external input in an is electromagneticinductive coupling or pressure sensitive manner.

FIG. 3 is a plan view of the display panel DP according to an exemplaryembodiment of the inventive concept. FIG. 4 is an equivalent circuitdiagram of the pixel PX according to an exemplary embodiment of theinventive concept. FIG. 5 is an enlarged cross-sectional view of thedisplay panel DP according to an exemplary embodiment of the inventiveconcept.

As illustrated in FIG. 3, the display panel DP includes a display areaDA and a non-display area NDA on a plane. In this exemplary embodiment,the non-display area NDA may be defined along an edge of the displayarea DA. The display area DA and the non-display area NDA of the displaypanel DP may correspond to the display area DD-DA and the non-displayarea DD-NDA of the display module DM of FIG. 1, respectively. It isunnecessary that the display area DA and the non-display area NDA of thedisplay panel DP respectively correspond to the display area DD-DA andthe non-display area DD-NDA of the display module DM. For example, thedisplay area DA and the non-display area NDA of the display panel DP maybe changed according to a structure/design of the display panel DP.

The display panel DP may include a driving circuit GDC, a plurality ofsignal lines SGL, and a plurality of pixels PX. The pixels PX aredisposed on the display area DA. Each of the pixels PX includes anorganic light emitting diode and a pixel driving circuit connected tothe organic light emitting diode. The driving circuit GDC, the pluralityof signal lines SGL, and the pixel driving circuit may be provided inthe circuit device layer DP-CL of FIG. 2.

The driving circuit GDC may include a scan driving circuit. The scandriving circuit GDC generates a plurality of scan signals, and the scansignals are successively outputted to a plurality of scan lines GL. Thescan driving circuit GDC may further output other control signals to thedriving circuit of each of the pixels PX.

The scan driving circuit GDC may include a plurality of thin filmtransistors that are manufactured through the same process as thedriving circuit of the pixel PX, e.g., a low temperature polycrystallinesilicon (LTPS) process or a low temperature polycrystalline oxide (LTPO)process.

The plurality of signal lines SGL includes scan lines GL, data lines DL,a power line PL, and a control signal line CSL. The scan lines GL arerespectively connected to corresponding pixels PX of the plurality ofpixels PX, and the data lines DL are respectively connected tocorresponding pixels PX of the plurality of pixels PX. The power line PLis connected to the plurality of pixels PX. The control signal line CSLmay provide control signals to the scan driving circuit GDC.

The display panel DP includes signal pads DP-PD connected to ends of thesignal lines SGL. The signal pads DP-PD may be a kind of circuit device.An area of the non-display area NDA, on which the signal pads DP-PD aredisposed, is defined as a pad area NDA-PD. Touch pads TS-PD connected totouch signal lines that will be described later may also be disposed onthe pad area NDA-PD.

The display panel DP may include a first protrusion part DMP. The firstprotrusion part DMP may extend along an edge of the display area DA. Thefirst protrusion part

DMP may surround the display area DA. A portion of the first protrusionpart DMP may be parallel to the pad area NDA-PD.

The display panel DP may include a second protrusion part BNP. Thesecond protrusion part BNP may be disposed between the display area DAand the pad area NDA-PD. The second protrusion part BNP may be parallelto a portion of the first protrusion part DMP and the pad area NDA-PD.In an exemplary embodiment of the inventive concept, at least one of thefirst protrusion part DMP or the second protrusion part BNP may beomitted.

FIG. 4 illustrates an example of a pixel PX connected to one scan lineGL, one data line DL, and the power line PL. However, exemplaryembodiments of the inventive concept are not limited to the abovedescribed configuration of the pixel PX. For example, the pixel PX maybe variously deformed in configuration.

The organic light emitting diode OLED may be a top emission-type diodeor a bottom emission-type diode. The pixel PX includes a firsttransistor T1 (or a switching transistor), a second transistor T2 (or adriving transistor), and a capacitor Cst as the pixel driving circuitdriving the organic light emitting diode OLED. A first power voltageELVDD is provided to the second transistor T2, and a second powervoltage ELVSS is provided to the organic light emitting diode OLED. Thesecond power voltage ELVSS may be less than the first power voltageELVDD.

The first transistor T1 outputs a data signal applied to the data lineDL in response to a scanning signal applied to the scan line GL. Thecapacitor Cst charges a voltage to correspond to the data signalreceived from the first transistor T1.

The second transistor T2 is connected to the organic light emittingdiode OLED. The second transistor T2 controls driving current flowingthrough the organic light emitting diode OLED to correspond to a chargeamount stored in the capacitor Cst. The organic light emitting diodeOLED emits light during a turn-on period of the second transistor T2.

FIG. 5 illustrates a partial cross-sectional view of the display panelDP corresponding to the equivalent circuit of FIG. 4. The circuit devicelayer DP-CL, the display device layer DP-OLED, and the thin filmencapsulation layer TFE are successively disposed on the base layer SUB.

The circuit device layer DP-CL includes at least one inorganic layer, atleast one organic layer, and a circuit device. The circuit device layerDP-CL may include a buffer layer BFL, a first intermediate inorganiclayer 10, and a second intermediate inorganic layer 20, which areinorganic layers, and an intermediate organic layer 30 that is anorganic layer.

The inorganic layers may include silicon nitride, silicon oxynitride,silicon oxide, and the like. The organic layer may include at least oneof an acrylic-based resin, a methacrylic-based resin, apolyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, aurethane-based resin, a cellulose-based resin, a siloxane-based resin, apolyimide-based resin, a polyamide-based resin, or a perylene-basedresin. The circuit device includes conductive patterns and/orsemiconductor patterns.

The buffer layer BFL improves a coupling force between conductivepatterns or semiconductor patterns. Although not separately shown, abarrier layer for preventing foreign substances from being introducedmay be further disposed on a top surface of the base layer SUB. Thebuffer layer BFL and the barrier layer may be selectivelydisposed/omitted.

A semiconductor pattern OSP1 (hereinafter, referred to as a firstsemiconductor pattern) of the first transistor T1 and a semiconductorpattern OSP2 (hereinafter, referred to as a second semiconductorpattern) of the second transistor T2 are disposed on the buffer layerBFL. Each of the first and second semiconductor patterns OSP1 and OSP2may be selected from amorphous silicon, polysilicon, and a metal oxidesemiconductor.

The first intermediate inorganic layer 10 is disposed on the firstsemiconductor pattern OSP1 and the second semiconductor pattern OSP2. Acontrol electrode GE1 (hereinafter, referred to as a first controlelectrode) of the first transistor T1 and a control electrode GE2(hereinafter, referred to as a second control electrode) of the secondtransistor T2 are disposed on the first intermediate inorganic layer 10.The first and second control electrodes GE1 and GE2 may be manufacturedby the same photolithography process as the scan lines GL (see FIG. 5A).

The second intermediate inorganic layer 20 covering the first and secondcontrol electrodes GE1 and GE2 is disposed on the first intermediateinorganic layer 10. An input electrode DE1 (hereinafter, referred to asa first input electrode) and an output electrode SE1 (hereinafter,referred to as a first output electrode) of the first transistor T1 andan input electrode DE2 (hereinafter, referred to as a second inputelectrode), and an output electrode SE2 (hereinafter, referred to as asecond output electrode) of the second transistor T2 are disposed on thesecond intermediate inorganic layer 20.

The first input electrode DE1 and the first output electrode SE1 areconnected to the first semiconductor pattern OSP1 through first andsecond through-holes CH1 and CH2, which pass through the first andsecond intermediate inorganic layers 10 and 20, respectively. The secondinput electrode DE2 and the second output electrode SE2 are connected tothe second semiconductor pattern OSP2 through third and fourththrough-holes CH3 and CH4, which pass through the first and secondintermediate inorganic layers 10 and 20, respectively. According toanother exemplary embodiment of the inventive concept, portions of thefirst and second transistors T1 and T2 may be deformed into a bottomgate structure.

The intermediate organic layer 30 covering the first input electrodeDE1, the second input electrode DE2, the first output electrode SE1, andthe second output electrode SE2 is disposed on the second intermediateinorganic layer 20. The intermediate organic layer may provide aplanation surface.

The display device layer DP-OLED is disposed on the intermediate organiclayer 30. The display device layer DP-OLED may include a pixel defininglayer PDL and an organic light emitting diode OLED. The pixel defininglayer PDL may include an organic material, like the intermediate organiclayer 30. A first electrode AE is disposed on the intermediate organiclayer 30. The first electrode AE is connected to the second outputelectrode SE2 through the fifth through-hole CH5 passing through theintermediate organic layer 30. An opening OP is defined in the pixeldefining layer PDL. The opening OP of the pixel defining layer PDLexposes at least a portion of the first electrode AE.

The pixel PX may be disposed on a pixel area on a plane. The pixel areamay include an emission area PXA and a non-emission area NPXA that isadjacent to the emission area PXA. The non-emission area NPXA maysurround the emission area PXA. In this exemplary embodiment, theemission area PXA may be defined to correspond to a portion of the firstelectrode AE exposed by the opening OP.

A hole control layer HCL may be commonly disposed on the emission areaPXA and the non-emission area NPXA. Although not separately shown, acommon layer such as the hole control layer HCL may be commonly disposedon the plurality of pixels PX (see FIG. 3).

The emission layer EML is disposed on the hole control layer HCL. Theemission layer EML may be disposed on an area corresponding to theopening OP. That is, the emission layer EML may be formed to beseparated from each other in the plurality of pixels PX. Also, theemission layer EML may include an organic material and/or an inorganicmaterial. Although the patterned emission layer EML is illustrated as anexample in this exemplary embodiment, the emission layer EML may becommonly disposed on the plurality of pixels PX. Here, the emissionlayer EML may emit white light. Also, the emission layer EML may have amultilayer structure.

An electronic control layer ECL is disposed on the emission layer EML.Although not separately shown, the electronic control layer ECL may becommonly disposed on the plurality of pixels PX (see FIG. 3).

A second electrode CE is disposed on the electronic control layer ECL.The second electrode CE is commonly disposed on the plurality of pixelsPX.

The thin film encapsulation layer TFE is disposed on the secondelectrode CE. The thin film encapsulation layer TFE is commonly disposedon the plurality of pixels PX. In this exemplary embodiment, the thinfilm encapsulation layer TFE directly covers the second electrode CE. Inan exemplary embodiment of the inventive concept, a capping layercovering the second electrode CE may be further disposed between thethin film encapsulation layer TFE and the second electrode CE. Here, thethin film encapsulation layer TFE may directly cover the capping layer.

FIG. 6A is a cross-sectional view of the touch sensing unit TS accordingto an exemplary embodiment of the inventive concept. FIG. 6B is a planview of the touch sensing unit according to an exemplary embodiment ofthe inventive concept. FIG. 7A is a cross-sectional view of the touchsensing unit TS according to an exemplary embodiment of the inventiveconcept. FIG. 7B is a plan view of the touch sensing unit according toan exemplary embodiment of the inventive concept.

As illustrated in FIG. 6A, the touch sensing layer TS include a firstconductive layer TS-CL1, a first insulation layer TS-IL1 (hereinafter,referred to as a first touch insulation layer or touch inorganic layer),a second conductive layer TS-CL2, and a second insulation layer TS-IL2(hereinafter, referred to as a second touch insulation layer or touchorganic layer). The first conductive layer TS-CL1 may be directlydisposed on the thin film encapsulation layer TFE. Exemplary embodimentsof the inventive concept are not limited thereto. For example, anotherinorganic layer or organic layer may be further disposed between thefirst conductive layer TS-CL1 and the thin film encapsulation layer TFE.

Each of the first conductive layer TS-CL1 and the second conductivelayer TS-CL2 may have a single-layer structure or a multilayer structurein which a plurality of layers are laminated in the third directionalaxis DR3. The conductive layer having the multilayer structure mayinclude a transparent conductive layer and at least two metal layers.The conductive layer having the multilayer structure may include metallayers including metals different from each other. The transparentconductive layer may include indium tin oxide (ITO), indium zinc oxide(IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO), PEDOT, a metalnano wire, and graphene. The metal layer may include molybdenum, silver,titanium, copper, aluminum, and an alloy thereof. For example, each ofthe first and second conductive layers TS-CL1 and TS-CL2 may have athree-layer structure of titanium/aluminum/titanium.

Each of the first and second conductive layers TS-CL1 and TS-CL2 mayinclude a plurality of patterns. Hereinafter, an example in which thefirst conductive layer TS-C11 includes first conductive patterns, andthe second conducive layer TS-CL2 includes second io conductive patternswill be described. Each of the first and second conductive patterns mayinclude touch electrodes and touch signal lines.

Each of the first and second touch insulation layers TS-IL1 and TS-IL2may include inorganic or organic material. At least one of the first andsecond touch insulation layers TS-IL1 and TS-IL2 may include aninorganic layer. The inorganic layer may include at least one ofaluminum oxide, titanium oxide, silicon oxide, silicon oxynitride,zirconium oxide, or hafnium oxide.

At least one of the first and second touch insulation layers TS-IL1 andTS-IL2 may include an organic layer. The organic layer may include atleast one of an acrylic-based resin, a methacrylic-based resin, apolyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, aurethane-based resin, a cellulose-based resin, a siloxane-based resin, apolyimide-based resin, a polyamide-based resin, or a perylene-basedresin. In this exemplary embodiment, the first touch insulation layerTS-IL1 is described as a inorganic touch layer, and the second touchinsulation layer TS-IL2 is described as a touch organic layer. Asillustrated in FIG. 6B, the touch sensing unit TS may include firsttouch electrodes TE1-1 to TE1-5, first touch signal lines SL1-1 to SL1-5connected to the first touch electrodes TE1-1 to TE1-1, second touchelectrodes TE2-1 to TE2-4, second touch signal lines SL2-1 to SL2-4connected to the second touch electrodes TE2-1 to TE2-4, and touch padsTS-PD connecting the first touch signal lines SL1-1 to SL1-5 to thesecond touch signal lines SL2-1 to SL2-4. The first touch signal linesSL1-1 to SL1-5 are connected to ends of the first touch electrodes TE1-1to TE1-5, respectively. The second touch signal lines SL2-1 to SL2-4 areconnected to both ends of the second touch electrodes TE2-1 to TE2-4,respectivley. In an exemplary embodiment of the inventive concept, thefirst touch signal lines SL1-1 to SL1-5 may also be connected to bothends of the first touch electrodes TE1-1 to TE1-5, or the second touchsignal lines SL2-1 to SL2-4 may be respectively connected to ends of thesecond touch electrodes TE2-1 to TE2-4. The first protrusion part DMPand the second protrusion part BNP provided in the display panel DP areadditionally illustrated in FIG. 6B so as to represent a relativeposition with respect to the touch sensing unit TS.

Each of the first touch electrodes TE1-1 to TE1-5 may have a mesh shapein which a plurality of touch openings are defined. Each of the firsttouch electrodes TE1-1 to TE1-5 includes a plurality of first touchsensing parts SP1 and a plurality of first connection parts CP1. Thefirst touch sensing parts SP1 are arranged in the second direction DR2.Each of the first connection parts CP1 connects two first touch sensingparts SP1, which are adjacent to each other, of the first touch sensingparts SP1. Although not separately shown, the first touch signal linesSL1-1 to SL1-5 may also have a mesh shape.

The second touch electrode TE2-1 and TE2-4 are insulated from the firsttouch electrodes TE1-1 to TE1-5 and cross the first touch electrodesTE1-1 to TE1-5. Each of the second touch electrodes TE2-1 to TE2-4 mayhave a mesh shape in which a plurality of touch openings are defined.Each of the second touch electrodes TE2-1 to TE2-4 includes a pluralityof second touch sensing parts SP2 and a plurality of second connectionparts CP2. The second touch sensing parts SP2 are arranged in the firstdirection DR1. Each of the second connection parts CP2 connects twosecond touch sensing parts SP2, which are adjacent to each other, of thesecond touch sensing parts SP2. The second touch signal lines SL2-1 orSL2-4 may also have a mesh shape.

The first touch electrode TE1-1 to TE1-5 and the second touch electrodeTE2-1 to TE2-4 are capacitively coupled to each other. Since touchdetection signals are applied to the first touch electrodes TE1-1 toTE1-5, capacitors are disposed between the first touch sensing parts SP1and the second touch sensing parts SP2.

Portions of the plurality of first touch sensing parts SP1, theplurality of first connection parts CP1, and the first touch signallines SL1-1 to SL1-5 and portions of the plurality of second touchsensing parts SP2, the plurality of second connection parts CP2, and thesecond touch signal lines SL2-1 to SL2-4 may be formed by patterning thefirst conductive layer TS-CL1 of FIG. 6A, and the other portions may beformed by patterning the second conductive layer TS-CL2 of FIG. 6A. Inthis exemplary embodiment, the plurality of first connection parts CP1may be formed from the first conductive layer TS-CL1, and the pluralityof first touch sensing parts SP1, the first touch signal lines SL1-1 toSL1-5, the plurality of second touch sensing parts SP2, the plurality ofsecond connection parts CP2, and the second touch signal lines SL2-1 toSL2-4 may be formed from the second conductive layer TS-CL2.

Although the touch sensing unit TS in which the plurality of firstconnection parts CP1 and the plurality of second connection parts CP2cross each other is illustrated as an example, exemplary embodiments ofthe inventive concept are not limited thereto. For example, each of thesecond connection parts CP2 may be deformed into a V shape so that thesecond connection parts CP2 do not overlap the plurality of firstconnection parts CP1. The V-shaped second connection parts CP2 mayoverlap the first touch sensing parts SP1. Although the first and secondtouch sensing parts SP1 and SP2, each of which has a diamond ortriangular shape, are illustrated in this exemplary embodiment,exemplary embodiments of the inventive concept are not limited thereto.

As illustrated in FIG. 7A, the touch sensing unit TS according to anexemplary embodiment of the inventive concept may be a single-layertouch sensing unit including the conductive layer TS-CL and theinsulation layer TS-IL (touch insulation layer). The single-layer touchsensing unit may acquire coordinate information in a self cap manner.

The conductive layer TS-CL may have a single-layer structure or amultilayer structure in which a plurality of layers are laminated in thethird directional axis DR3. The conductive layer having the multilayerstructure may include at least two of the transparent conductive layersand the metal layers. The conductive layer TS-CL includes a plurality ofpatterns such as the touch electrode and the touch signal lines. Thetouch insulation layer TS-IL includes at least inorganic layer. Thetouch insulation layer TS-IL may further include an organic layer.

The touch sensing unit TS include touch electrodes TE disposed spacedapart from each other and touch signal lines SL. The touch electrodes TEmay be arranged in the form of a matrix, and the touch signal lines SLmay be respectively connected to the touch electrodes TE. Exemplaryembodiments of the inventive concept are not particularly limited to theshape and arrangement of the touch electrodes TE. A portion of the touchsignal lines SL may be disposed on the display area DA, and a portion ofthe touch signal lines SL may be disposed on the non-display area NDA.

FIGS. 8A and 8B are enlarged cross-sectional views of the display moduleDM according to an exemplary embodiment of the inventive concept. FIG.8A is a cross-sectional view taken along line I-I′ of FIG. 6B, and FIG.8B is a cross-sectional view taken along line II-II′ of FIG. 6B. FIG. 8Cis a cross-sectional view taken along line III-III' of FIG. 6B. FIG. 8Billustrates a cross-section that overlaps the data line DL, and FIG. 8Cillustrates a cross-section that overlaps the touch signal line SL.

The circuit device layer DP-CL, the display device layer DP-OLED, andthe thin film encapsulation layer TFE, which are disposed on the displayarea DA, have the same laminated structure as the constitutionsdescribed with reference to FIG. 5, and thus, their detaileddescriptions will be omitted. However, the hole control layer HCL andthe electron control layer ECL are not illustrated in FIGS. 8A and 8B.The touch sensing unit TS has the same laminated structure as thatdescribed with reference to FIGS. 6A and 6B, and thus, its detaileddescribed will be omitted. The thin film encapsulation layer TFEincluding a first encapsulation inorganic layer IOL1, a secondencapsulation inorganic layer IOL2, and an encapsulation organic layerOL disposed between the first encapsulation inorganic layer IOL1 and thesecond encapsulation inorganic layer IOL2 will be described as anexample.

As illustrated in FIGS. 8A and 8B, a scan driving circuit GDCconstituting the circuit device layer DP-CL is disposed on thenon-display area NDA. The scan driving circuit GDC includes at least onetransistor GDC-T manufactured through the same process as the pixeltransistor T2. The scan driving circuit GDC may include signal linesGSC-SL disposed on the same layer as the input electrode of the pixeltransistor T2. Although are not separately shown, the scan drivingcircuit GDC may further include signal lines disposed on the same layeras the control electrode of the pixel transistor T2.

A power electrode PWE providing the second power voltage ELVSS isdisposed outside the scan driving circuit GDC. The power electrode PWEmay receive a second power voltage from the outside. A connectionelectrode E-CNT is disposed on the intermediate organic layer 30. Theconnection electrode E-CNT connects the power electrode PWE to thesecond electrode CE. Since the connection electrode E-CNT ismanufactured through the same process as the first electrode AE, theconnection electrode E-CNT may include the same layer structure and thesame material as the first electrode AE. The connection electrode E-CNTmay have the same thickness as the first electrode AE.

One data line DL disposed on the second intermediate inorganic layer 20is illustrated as an example. The signal pad DP-PD is connected to anend of the data line DL.

As illustrated in FIGS. 8A to 8C, the first protrusion part DMP may havea multilayer structure. A lower portion DM1 may be formed at the sametime as the intermediate organic layer 30, and an upper portion DM2 maybe formed at the same time as the pixel defining layer PDL. The firstprotrusion part DMP may prevent a liquid organic material from beingspread to the outside of each of the intermediate inorganic layers 10and 20 while the encapsulation organic layer OL is formed. The liquidorganic material of the encapsulation organic layer OL may be formed onthe first encapsulation inorganic layer IOL1 in an inkjet manner. Here,the first protrusion part DMP may set a boundary of an area on which theliquid organic material is disposed.

The second protrusion part BNP may have a multilayer structure. A lowerportion BN1 may be formed at the same time as the intermediate organiclayer 30, and an upper portion BN2 may be formed at the same time as thepixel defining layer PDL. The upper portion BN2 has a stepped portionand includes a first portion BN2-1 and a second portion BN2-2, which areintegrated with each other. The second protrusion part BNP has a heightgreater than that of the first protrusion part DMP by a height of thesecond portion BN2-2. The second protrusion part BNP supports a maskthat is used while the encapsulation inorganic layers IOL1 and IOL2 areformed.

The circuit device layer DP-CL may further include an outer organiclayer 30-O connected to the second protrusion part BNP. The outerorganic layer 30-O may have a multilayer structure. The outer organiclayer 30-O may include a lower portion that is formed at the same timeas the intermediate organic layer 30 and an upper portion that is formedat the same time as the pixel defining layer PDL. The outer organiclayer 30-O is spaced apart from the intermediate organic layer 30 anddisposed between the display area DA and the pad area NDA-PD.

The first encapsulation inorganic layer IOL1 and the secondencapsulation inorganic layer IOL2 overlap the first protrusion partDMP. The first encapsulation inorganic layer IOL1 and the secondencapsulation inorganic layer IOL2 may also overlap the secondprotrusion part BNP. The intermediate organic layer 30 and the firstprotrusion part DMP are spaced apart from each other, and the firstprotrusion part DMP and the second protrusion part BNP are spaced apartfrom each other. Thus, an organic material is not disposed between theintermediate organic layer 30 and the first protrusion part DMP andbetween the first protrusion part DMP and the second protrusion partBNP. The first encapsulation inorganic layer IOL1 may contact the secondintermediate inorganic layer 20 on the above-described spaced areas.Although a portion of the data line DL is disposed between the secondintermediate inorganic layer 20 and the first encapsulation inorganiclayer IOL1 in FIG. 8B, the first encapsulation inorganic layer IOL1 andthe second intermediate inorganic layer 20 may contact each other on theother area on which the data line DL is not disposed, as illustrated inFIG. 8C.

The inorganic touch layer TS-IL1 overlaps the first protrusion part DMPand the second protrusion part BNP. The inorganic touch layer TS-IL1contacts the second intermediate inorganic layer 20, which is exposedfrom the intermediate organic layer 30, the first protrusion part DMP,the second protrusion part BNP, and the outer organic layer 30-O.Although the data line DL is disposed between the inorganic touch layerTS-IL1 and the second intermediate inorganic layer 20 in FIG. 8B, theinorganic touch layer TS-IL 1 and the second intermediate inorganiclayer 20 may contact each other on the other area on which the data lineDL is not disposed, as illustrated in FIG. 8C.

FIGS. 9A and 9B are plan views illustrating a process of manufacturingthe display module DM according to an exemplary embodiment of theinventive concept. FIGS. 10A to 10C are views illustrating a process offorming the thin film encapsulation layer TFE of FIGS. 8A and 9B.

FIG. 9A is a plan view illustrating edges of the second intermediateinorganic layer 20, the intermediate organic layer 30, the outer organiclayer 30-O, and the second encapsulation inorganic layer IOL2, which aredescribed with reference to FIGS. 8A to 8C. Although not separatelyshown, the first intermediate inorganic layer 10 may have substantiallythe same shape as the second intermediate inorganic layer 20 on a plane.The first encapsulation inorganic layer IOL1 and the secondencapsulation inorganic layer IOL2 may have substantially the same shapeon the plane. The edge of the encapsulation organic layer OL may have ashape corresponding to that of the first protrusion part DMP. The bufferlayer BFL may have the same shape as the base layer SUB.

The second intermediate inorganic layer 20 overlaps the display area DAand the non-display area NDA. The edge of the second intermediateinorganic layer 20 may have a shape similar to that of the base layerSUB. The second intermediate inorganic layer 20 is disposed inside theedge of the base layer SUB and also disposed adjacent to edge of thebase layer SUB.

The intermediate organic layer 30 overlaps the display area DA and thenon-display area NDA. The intermediate organic layer 30 is disposedinside the second intermediate inorganic layer 20. That is, the edge ofthe intermediate organic layer 30 is disposed inside the edge of thesecond intermediate inorganic layer 20. The edge of the intermediateorganic layer 30 is disposed adjacent to a boundary between the displayarea DA and the non-display area NDA. Thus, the intermediate organiclayer 30 exposes a portion of the second intermediate inorganic layer 20within the non-display area NDA. The intermediate organic layer 30 mayexpose an edge portion of the second intermediate inorganic layer 20within the non-display area NDA.

The outer organic layer 30-O is connected to the second protrusion partBNP, spaced apart from the intermediate organic layer 30, and disposedbetween the display area DA and the pad area NDA-PD. The outer organiclayer 30-O exposes a portion of the second intermediate inorganic layer20 within the non-display area NDA.

The second encapsulation inorganic layer IOL2 overlaps the display areaDA and the non-display area NDA. As illustrated in FIG. 9B, the secondencapsulation inorganic layer IOL2 may include a first region IOL2-1overlapping the display area DA and a second region IOL2-2 overlappingthe non-display area NDA. The first region IOL2-1 may further overlapthe non-display area NDA, and the second region IOL2-2 may not overlapthe display area DA.

The second region IOL2-2 is thinner than the first region IOL2-1. Also,the second region IOL2-2 has a film density lower than that of the firstregion IOL2-1. As described below, this is done because the secondencapsulation inorganic layer IOL2 is deposited by using an open-typemask. Although not separately shown, the first encapsulation inorganiclayer IOL1 may also have a first region and a second region having athickness less than that of the first region. This is done because thefirst and second encapsulation inorganic layers IOL1 and IOL2 are formedby using the same mask.

FIGS. 10A to 10C are views illustrating a process of forming the thinfilm encapsulation layer TFE of FIGS. 8A and 8B.

As illustrated in FIG. 10A, the same process is performed on a pluralityof cell areas C-SUB defined on a mother substrate MS, and the displaymodule DM is formed on each of the plurality of cell areas C-SUB. Afterthe manufacturing process is completed, the mother substrate MS is cutto separate the display modules DM from each other.

The first encapsulation inorganic layer IOL1, the encapsulation organiclayer OL, is and the second encapsulation inorganic layer IOL2, whichare illustrated in FIGS. 8A and 8C, are successively formed. Here, theencapsulation organic layer OL is formed in the above-described injectmanner. The first encapsulation inorganic layer IOL1 and the secondencapsulation inorganic layer IOL2 are formed through a depositionprocess that will be described below. The second encapsulation inorganiclayer IOL2 will be mainly described below.

As illustrated in FIGS. 10A and 10B, a mask MSK in which a plurality ofopenings M-OP are defined is aligned with the mother substrate MS. Eachof the openings M-OP may correspond to the display area DA illustratedin FIGS. 9A and 9B. The mother substrate MS with which the mask MSK isaligned is disposed in a deposition chamber, and then, an inorganicmaterial is deposited on the mother substrate MS.

The display module DP-1 of FIG. 10B has a configuration that is formedup to the display device layer DP-OLED of the display panel DP of FIG.2. The mask MSK is supported by the second protrusion part BNP. Since agap is maintained between the mask MSK and the display module DP-1, theinorganic material is deposited on an area greater than that of theopening M-OP. That is, the inorganic material is deposited on thenon-display area NDA as well as the display area DA. Thus, the secondencapsulation inorganic layer IOL2 having the configuration illustratedin FIG. 9B is formed.

As illustrated in FIG. 10C, since the second region IOL2-2 of the secondencapsulation inorganic layer IOL2 overlaps the mask MSK, an amount ofinorganic material may be relatively lower. Thus, the second regionIOL2-2 has a thickness TH2 less than a thickness TH1 of the first regionIOL2-1. The second thickness TH2 of the second region IOL2-2 maygradually decrease in a direction that is away from the first regionIOL2-1. That is, the second thickness TH2 of the second region IOL2-2becomes smaller as a distance from the first region IOL2-1 increases.Also, the second region IOL2-2 has a density lower than that of thefirst region IOL2-1. This is done because ashing gases used for removingorganic residues before the encapsulation inorganic layer is depositedexist around the mask MSK to restrict the deposition.

The second region IOL2-2 having a thin thickness and the lower filmdensity may be relatively week in coupling force with respect to thelower layer when compared to the first region IOL2-1. Particularly, whenthe lower layer is the organic layer, moisture may be penetrated throughan interface between the inorganic layer and the organic layer, andthus, the inorganic layer may be delaminated. Since the intermediateorganic layer 30 or the pixel defining layer PDL, which is the inorganiclayer, is disposed on a lower portion of the first encapsulationinorganic layer IOL1, the second encapsulation inorganic layer IOL2 maybe more easily delaminated.

According to an exemplary embodiment of the inventive concept, toprevent the inorganic layer from be delaminated, the inorganic touchlayer contacts the second intermediate inorganic layer 20 exposed by theintermediate organic layer 30 within the non-display area NDA.Hereinafter, this will be described in more detail with reference toFIGS. 11A and 11B.

FIGS. 11A and 11B are plan views comparing the display module DMaccording to an exemplary embodiment of the inventive concept to adisplay module DM-S according to Comparative Example.

According to the exemplary embodiment of FIG. 11A, the inorganic touchlayer TS-IL1 contacts the second intermediate inorganic layer 20 exposedby the intermediate organic layer 30 within the non-display area NDA. Acorner area AA of the second encapsulation inorganic layer IOL2 isexpressed by dotted lines. The second encapsulation inorganic layer IOL2contacts the inorganic touch layer TS-IL1 on the corner area AA. Sincethe inorganic touch layer TS-IL1 contacts the second intermediateinorganic layer 20 on the corner area AA, the second encapsulationinorganic layer IOL2 disposed between the inorganic touch layer TS-IL1and the second intermediate inorganic layer 20 may be sealed to block apenetration path of the moisture, which is expressed by an arrow.

In addition, the inorganic touch layer TS-IL1 contacts the secondintermediate inorganic layer 20 along an edge of the display area DA.The second encapsulation inorganic layer IOL2 is sealed along the edgeof the display area DA. The inorganic touch layer TS-IL1 and the secondintermediate inorganic layer 20 contact each other within the pad areaNDA-PD.

An edge of the inorganic touch layer TS-IL1 may be disposed inside anedge of the second intermediate inorganic layer 20. An edge of the outerorganic layer 30-O is disposed inside the edge of the inorganic touchlayer TS-ILL The inorganic touch layer TS-IL1 may contact a portion ofthe second intermediate inorganic layer 20 exposed from the outerorganic layer 30-O within the non-display area NDA. The secondintermediate inorganic layer 20 and the inorganic touch layer TS-IL1 maycontact each other on the pad area NDA-PD.

According to Comparative Example of FIG. 11B, an intermediate organiclayer 30 has substantially the same shape as a second intermediateinorganic layer 20 in plan view. Since a inorganic touch layer TS-IL1 isdisposed on the intermediate organic layer 30, the inorganic touch layerTS-IL1 does not contact the second intermediate inorganic layer 20. Themoisture penetrated in the arrow direction delaminates the encapsulationinorganic layer. Particularly, a second region of the encapsulationinorganic layer having a lower film density may be delaminated.

According to the exemplary embodiment, defects due to the moisture maybe reduced when compared to the display module DM-S according toComparative Example. As described above, this is done because thedisplay panel DP includes the patterned organic layer, and the inorganiclayer of the touch sensing layer TS contacts the exposed portion of theinorganic layer of the display panel DP.

FIGS. 12A and 12B are perspective views of a display module DM accordingto an exemplary embodiment of the inventive concept. FIG. 13 is a planview of the display module DM according to an exemplary embodiment ofthe inventive concept. FIG. 14 is a cross-sectional view of the displaymodule DM according to an exemplary embodiment of the inventive concepttaken along line VI-VI′ in FIG. 13. Hereinafter, detailed descriptionswith respect to the same constituent as that described with reference toFIGS. 1 to 11B will be omitted.

As illustrated in FIGS. 12A and 12B, the display module DM includes afirst non-bending area NBA1, a second non-bending area NBA2 spaced apartfrom the first non-bending area NBA1 in the first direction DR1, and abending area BA defined between the first non-bending area NBA1 and thesecond non-bending area NBA2. A display area DA may be included in thefirst non-bending area NBA1. Portions of a non-display area NDArespectivley correspond the second non-bending area NBA2 and the bendingarea BA, and a portion of the non-display area NDA, which is adjacent tothe display area DA, is included in the first non-bending area NBA1.

The bending area BA may be bent so that a bending axis BX is definedalong the second direction DR2 perpendicular to the first direction DR1.The second non-bending area NBA2 faces the first non-bending area NBA1.Each of the bending area BA and the second non-is bending area NBA2 mayhave a width in the second direction DR2, which is less than that of thefirst non-bending area NBA1. Although not separately shown, the displaymodule DM of FIG. 1 may also include a bending area corresponding to thebending area BA.

As illustrated in FIG. 13, although the bending area BA is provided, thesame plane structure as that of FIG. 11A may be provided. Thus, apenetration path of moisture as expressed by an arrow of FIG. 11A may beblocked. This is done because a inorganic touch layer TS-IL1 contacts aportion of a second intermediate inorganic layer 20 exposed from anorganic layer of a display panel DP within the non-display area NDA.

As illustrated in FIG. 14, a groove GRV through which the non-displayarea NDA of a base layer SUB is bent may be defined in each of a bufferlayer BFL and the intermediate inorganic layers 10 and 20. A dummyorganic pattern DOP may be disposed inside the groove GRV. Since theinorganic layer is removed from the bending area BA, stress of thebending area BA may be reduced, and thus cracks of the intermediateinorganic layers 10 and 20 may be prevented from occurring.

FIG. 15 is a perspective view of a display module DM according to anexemplary embodiment of the inventive concept. FIG. 16 is a plan view ofthe display module DM according to an exemplary embodiment of theinventive concept. FIG. 17 is a cross-sectional view of the displaymodule DM according to an exemplary embodiment of the inventive concepttaken along line VII-VII' in FIG. 16. Hereinafter, detailed descriptionswith respect to the same constituent as that described with reference toFIGS. 1 to 13 will be omitted.

As illustrated in FIGS. 15 and 16, the display module DM may include afirst non-bending area NBA1, a second non-bending area NBA2, a firstbending area BA1, a second bending area BA2, and a third bending areaBA3. The display module DM may further include is the second bendingarea BA2 and the third bending area BA3 when compared to the displaymodule DM of FIGS. 12A and 12B.

The second bending area BA2 and the third bending area BA3 are spacedapart from each other in the second direction DR2 with the firstnon-bending area NBA1 therebetween. Each of the second bending area BA2and the third bending area BA3 may have a curvature radius greater thanthat of the first bending area BA1. A pixel PX (see FIG. 3) may bedisposed on a portion of each of the second and third bending areas BA2and BA3.

As illustrated in FIGS. 16 and 17, inorganic material lines DM-CPdisposed outside an edge of an intermediate organic layer 30 andextending along the edge of the intermediate organic layer 30 may bedisposed on the second and third bending areas BA2 and BA3.

The inorganic material lines DM-CP may be spaced apart from each otherin the second direction DR2 and extend in the first direction DR1. Eachof the inorganic material lines DM-CP may include a first layer DM-C1and a second layer DM-C2. The second layer DM-C2 may have the samethickness as the first intermediate inorganic layer 10 and include thesame material as the first intermediate inorganic layer 10. The firstlayer DM-C1 may have the same thickness as the second intermediateinorganic layer 20 and include the same material as the secondintermediate inorganic layer 20.

A inorganic touch layer TS-IL1 may be spaced apart from the inorganicmaterial lines DM-CP. A touch organic layer TS-IL2 may overlap theinorganic material lines DM-CP. The touch organic layer TS-IL2 maycontact the inorganic material lines DM-CP. The touch organic layerTS-IL2 may contact a buffer layer BFL that are positioned under theinorganic material lines DM-CP.

When an external impact is applied to an edge of the display module DM,the inorganic material lines DM-CP may be broken to absorb the impact.The touch organic layer TS-IL2 may stop an occurrence of cracks of theinorganic material lines DM-CP and prevent the cracks from beingexpanded to an occurrence of cracks of other components.

As described above, although the encapsulation inorganic layer includesthe second region having the low film density, the encapsulationinorganic layer may not be delaminated. This is done because theinorganic layer of the touch sensing layer is directly deposited on theinorganic layer of the display panel to compress the encapsulationinorganic layer between the inorganic layers. In addition, the inorganiclayer of the touch sensing layer may be directly deposited on theinorganic layer of the display panel to block the permeation path ofmoisture.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concept is not limitedto such embodiments, but rather to the broader scope of the presentedclaims and various obvious modifications and equivalent arrangements.

What is claimed is:
 1. A display module comprising: a base layercomprising a display area and a non-display area disposed outside thedisplay area; a circuit device layer comprising an intermediateinorganic layer overlapping the display area and the non-display area,an intermediate organic layer disposed on the intermediate inorganiclayer to expose a portion of the intermediate inorganic layer within thenon-display area, and a circuit device, the circuit device layer beingdisposed on the base layer; a display device layer disposed on thecircuit device layer and comprising display devices disposed on thedisplay area; a thin film encapsulation layer comprising a firstencapsulation inorganic layer comprising a first region overlapping thedisplay area and a second region overlapping the non-display area andhaving a thickness less than that of the first region; and a touchsensing layer comprising a plurality of touch electrodes and a inorganictouch layer overlapping the display area and the non-display area andcontacting the portion of the is intermediate inorganic layer exposed bythe intermediate organic layer, the touch sensing layer being disposedon the thin film encapsulation layer.
 2. The display module of claim 1,wherein an edge of the intermediate organic layer is disposed inside anedge of the intermediate inorganic layer on a top surface of the baselayer.
 3. The display module of claim 1, wherein the thickness of thesecond region becomes smaller as a distance from the first regionincreases.
 4. The display module of claim 1, further comprising a firstprotrusion part disposed outside an edge of the intermediate organiclayer and extending along the edge of the intermediate organic layer. 5.The display module of claim 4, wherein the first protrusion partsurrounds the edge of the intermediate organic layer.
 6. The displaymodule of claim 4, wherein the circuit device comprises signal lineselectrically connected to the display devices and signal pads connectedto ends of the signal lines, and the signal pads are aligned in thenon-display area.
 7. The display module of claim 6, wherein a portion ofthe first protrusion part is parallel to the aligned signal pads, andthe display module further comprises a second protrusion part disposedbetween the portion of the first protrusion part and the signal pads andparallel to the portion of the first protrusion part.
 8. The displaymodule of claim 7, wherein the first protrusion part and the secondprotrusion part are disposed on the intermediate inorganic layer, andthe second protrusion part has a height greater than that of the firstprotrusion part.
 9. The display module of claim 7, wherein the firstencapsulation inorganic layer overlaps the first protrusion part and thesecond protrusion part.
 10. The display module of claim 7, furthercomprising an outer organic layer connected to the second protrusionpart, spaced apart from the intermediate organic layer, and disposedbetween the display area and the aligned signal pads.
 11. The displaymodule of claim 10, wherein an edge of the outer organic layer isdisposed inside an edge of the inorganic touch layer, and the edge ofthe inorganic touch layer is disposed inside the edge of theintermediate inorganic layer.
 12. The display module of claim 10,wherein a portion of the first encapsulation inorganic layer, which doesnot overlap the outer organic layer, is disposed between theintermediate inorganic layer and the inorganic touch layer, and theportion of the first encapsulation inorganic layer, which does notoverlap the outer organic layer, contacts the intermediate inorganiclayer and the inorganic touch layer.
 13. The display module of claim 1,wherein the non-display area comprises a first non-bending area, asecond non-bending area spaced apart from the first non-bending area ina first direction, and a bending area defined between the firstnon-bending area and the second non-bending area, and the bending areais bent so that a bending axis is defined in a second directionperpendicular to the first direction.
 14. The display module of claim 1,wherein the intermediate inorganic layer has a groove through which aportion of the non-display area of the base layer is exposed, and adummy organic pattern is disposed inside the groove.
 15. The displaymodule of claim 1, further comprising inorganic material lines disposedoutside an edge of the intermediate inorganic layer to extend along theedge of the intermediate inorganic layer.
 16. The display module ofclaim 15, wherein the inorganic touch layer is spaced apart from theinorganic material lines.
 17. The display module of claim 15, whereinthe touch sensing layer further comprises a touch organic layer disposedon the inorganic touch layer to cover the touch electrodes.
 18. Thedisplay module of claim 17, wherein the touch organic layer overlaps theinorganic material lines.
 19. The display module of claim 1, wherein thethin film encapsulation layer further comprises: a second encapsulationinorganic layer disposed between the display device layer and the firstencapsulation inorganic layer; and an encapsulation organic layerdisposed between the first encapsulation inorganic layer and the secondencapsulation inorganic layer.
 20. A display module comprising: a baselayer comprising a display area and a non-display area disposed outsidethe display area; a circuit device comprising an intermediate inorganiclayer overlapping the display area and the non-display area and anintermediate organic layer disposed on the intermediate inorganic layerto expose a portion of the intermediate inorganic layer within thenon-display area; organic light emitting diodes disposed on theintermediate organic layer to overlap the display area; an encapsulationinorganic layer disposed on the intermediate organic layer to cover theorganic light emitting diodes; and a touch sensing layer comprising aplurality of touch electrodes and an inorganic touch layer overlappingthe display area and the non-display area and contacting theintermediate inorganic layer exposed by the intermediate organic layer,the touch sensing layer being disposed is on the encapsulation inorganiclayer.